Reverse Surface Mount

LeeJalovec has developed an efficient technique for prototyping with surface mount devices.


  • fine tip soldering iron
    • The tip size is important. It must be very small for SMT work. 1/64" is as small as is avaialble for some soldering irons and that is about as large a tip as you would want to use. Temperature is of some importance. 600F is good for delicate work. 800F is too hot, the tip burns out (erodes) too fast. 700F is good for most work.
  • fine solder - 0.015" diameter - no larger
  • sponge & water for keeping the iron tip clean
    • The tip must be clean and bright with unoxidized solder. Wiping the tip in a damp sponge between each connection make for a fast and better made solder joint.
  • tweezers
  • fine tipped diagonal cutters
  • wire wrap wire
    • Wire warp wire has plastic insulation and is typically available in sizes for 28 to 30 guage. 32 gage is available on special order and is very useful. 28 and 30 gage are a bit on the large side for most SMD wiring but useful for power wiring.
  • magnet wire
  • "perf board" with copper fill. (Digikey )
  • 0805 SMT cap for bypassing
  • Copper foil.
  • #34 or #36 enamel magnet wire
  • bright work light
  • magnifying glass (depending on your eye sight)


Planning the layout

  • parts placement
  • power connections
  • connectors

Attaching parts
  • double sided tape
  • super glue & activator

Cutting wire

stripping wire wrap wire

  • hot tweezers
  • stripper tool
  • diagonal cutters

Making wire connections
  • With wire wrap wire
  • With magnet wire

Let me know of any ideas you have. I'll dabble with adding more to this as it comes to me.


Last edited December 4, 2002
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